Huawei exec teases very thin smartphone ahead of MWC debut, says company's eight-core chip is comingAlex Wagner - Deputy Managing Editor, News Desk
Huawei made some headlines at CES 2012 when it introduced the Ascend P1 S, which the company billed as the world's thinnest smartphone thanks to its 6.68mm thick body. The P1 S has been out-thinned by other devices since, with the Alcatel One Touch Idol Ultra recently claiming the title of world's thinnest with a 6.45mm body, but it looks like Huawei is set to snatch the crown back. Richard Yu, CEO of Huawei's Consumer Business Group, today told Engadget that his company is planning to introduce a new member in the P series of devices that'll be thinner than the One Touch Idol Ultra and will feature a metallic body. The upcoming handset will make its debut at MWC in February.
The Ascend P1 S had some nice specs for the time that it was introduced, so it'll be interesting to see what kind of features that Huawei crams into the frame of this new super thin device. Unfortunately, considering that the P1 S never saw an official U.S. release and that Alcatel has said that the One Touch Idol Ultra won't see a stateside launch because its thin body couldn't get FCC approval, the prospects of Huawei's new slim P device hitting our shelves aren't good. It'll still be worth checking out, though, and you can bet that we'll give you a shout once this mystery phone is unveiled.
In other Huawei news, Yu revealed to Engadget Chinese that his firm will be debuting an eight-core Cortex-A15 processor in the second half of the year. Samsung earlier this week introduced the eight-core Exynos 5 Octa, which features two four-core setups that divvy up its workloads based on how heavy they are. Most of the details of Huawei's octa-core chipset are still up in the air, and we've still got a bit of a wait ahead of us with the processor's 2H 2013 introduction, but at least spec hounds know that they've got at least one more eight-core chip to look forward to this year.