Yesterday Qualcomm teased that it'd have more details on the Snapdragon 845 to share today, and that's exactly what has happened.
The Snapdragon 845 is made with a 10nm LPP FinFET process and includes a Snapdragon X20 LTE modem. The X20 LTE modem supports peak download speeds of 1.2Gbps as well as 5x carrier aggregation, License Assisted Access (LAA), Dual SIM-Dual VoLTE, and 4x4 MIMO on up to three aggregated carriers.
Other connectivity options with the Snapdragon 845 include 60GHz 802.11ad Wi-Fi and integrated 802.11ac Wi-Fi with features that offer up to 16x faster connection setup.
Qualcomm also says that its improvements to Bluetooth 5 allow users to broadcast audio to multiple speakers, smartphones, or other devices simultaneously and can reduce wireless earbud battery consumption by up to 50 percent compared to the previous generation.
The Kryo 385 CPU included with the Snapdragon 845 is made up of four performance cores at up to 2.8GHz (a 25 percent increase from the previous generation) and four efficiency cores at up to 1.8GHz.
Also included with the Snapdragon 845 is the Adreno 630 Visual Processing Subsystem. Qualcomm touts that it's got 30 percent better graphics/video rendering and power reduction compared to the previous generation. There's improved 6DoF with hand-tracking and controller support in there, too.
The Spectra 280 image signal processor (ISP) included with the Snapdragon 845 features Active Depth Sensing, and multi-frame noise reduction. When it comes to video, it supports 4K HDR video capture at 60fps, up to 16MP stills at 60fps, and slow motion video capture of 720p at 480 frames per second.
Qualcomm says that the Snapdragon 845 is expected to begin shipping in commercial devices in early 2018. Xiaomi CEO Lei Jun has already confirmed that his company's next flagship smartphone will be powered by the Snapdragon 845.